How can i cut silicon solar cell?

I've tried using diferent tools and even heating them to trim down cell's fragility without luck. They other break in some other direction. THANKS
Answers:
the possession is cleaving. You want to cleave the wafer along a crystal axis. The easiest road to do this is get a incredibly hard verbs flat surface. put the wafer/cell/device on this surface. get a enormously very sharp fine point metal tool. push the exceedingly point of the tool down on the very turn-up of the wafer. Do not saw or shake, only just push. Increase presure without shaking your hand and the wafer will crack along a crystal axis. It might not crack along the axis you want and might verbs your device but you will at least know the direction of the axis after youve done it. The switch is to push straight down on the very boundary of the wafer short vibrating your tool.

Good luck.
You pretty much entail a very expensive saw or a laser cutter. You enjoy to know what the crystal direction is and cut along that.


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